<?xml version="1.0" encoding="utf-8" standalone="yes"?>
<rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom">
	<channel>
		<title>烤箱 on Quartz Infrared Heating Source</title>
		<link>http://quartz-ir-heat.com/zh/tags/%E7%83%A4%E7%AE%B1/</link>
		<description>Recent content in 烤箱 on Quartz Infrared Heating Source</description>
		<generator>Hugo</generator>
		<language>zh</language>
		
		
		
		
			<lastBuildDate>Sat, 25 Jul 2026 04:52:06 +0800</lastBuildDate>
		
			<atom:link href="http://quartz-ir-heat.com/zh/tags/%E7%83%A4%E7%AE%B1/index.xml" rel="self" type="application/rss+xml" />
			<item>
				<title>洁净室烤箱红外加热器</title>
				<link>http://quartz-ir-heat.com/zh/posts/comparing-infrared-heating-vs-forced-air-circulation-in-semiconductor-deep-processing/</link>
				<pubDate>Sat, 25 Jul 2026 04:52:06 +0800</pubDate>
				<guid>http://quartz-ir-heat.com/zh/posts/comparing-infrared-heating-vs-forced-air-circulation-in-semiconductor-deep-processing/</guid>
				<description>&lt;p&gt;&lt;img src=&#34;http://quartz-ir-heat.com/images/a071a4619f1d04d8f3e2839bd3740f1c.png&#34; alt=&#34;洁净室烤箱红外加热器&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;&lt;strong&gt;为什么我们要放弃使用热风炉进行部件干燥？&lt;/strong&gt;&lt;br&gt;&#xA;目前，许多半导体生产线仍然依赖热风来对部件进行加热和干燥处理。说实话，这确实是个瓶颈。因为空气的导热性很差，所以要想让晶圆或组件达到所需温度，就必须先加热炉内的每一立方英寸的空气，然后再等待对流效应发挥作用。这样一来，整个处理过程就会变得极其缓慢。&lt;/p&gt;</description>
			</item>
	</channel>
</rss>
